How should the circuit board do a good job of heat dissipation?

The circuit board does a good job of heat dissipation to ensure its good performance, so how do we do a good job of heat dissipation during the use of the circuit board? Let's take a look at it together.

1. For equipment using free convection air cooling, it is best to arrange integrated circuits (or other devices) in a vertical or horizontal manner.

2. In the horizontal direction, the high-power devices are arranged as close to the edge of the printed board as possible to shorten the heat transfer path; in the vertical direction, the high-power devices are arranged as close to the top of the printed board as possible to reduce the temperature of these devices when they are working. Impact.

3. The devices on the same printed board should be arranged as much as possible according to the amount of heat generated and the degree of heat dissipation. Devices with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed. At the top of the cooling airflow (at the entrance), devices (such as power transistors, large-scale integrated circuits, etc.) with high heat generation or good heat resistance are placed downstream of the cooling airflow.

4. It is better to place the temperature sensitive device in the lowest temperature area (such as the bottom of the device). Do not place it directly above the heating device. It is better to arrange multiple devices staggered on the horizontal plane.

5. The heat dissipation of the printed board in the device mainly depends on the air flow, so the air flow path should be researched in the design, and the device or printed circuit board should be reasonably configured. When air flows, it tends to flow in a place with low resistance, so when configuring the device on a printed circuit board, avoid leaving a large airspace in a certain area. The configuration of multiple printed circuit boards in the whole machine should also pay attention to the same problem.

Therefore, in the process of using the circuit board, we must pay attention to heat dissipation work, so as to ensure its good performance and meet people's production needs.