Routine maintenance of circuit board electroless copper plating solution

In the process of electroless copper plating of printed circuit boards, various substances in the solution must be continuously consumed. During the operation, the analysis and testing should be timely performed according to the production volume, and supplemented in time to maintain the stability of the solution.

With the continuation of production, the electroless copper plating solution is used repeatedly. Frequent addition of chemicals will gradually increase various impurities in the solution. Some old solutions should be replaced after a certain production cycle to increase the activity of electroless copper plating solution. To ensure the quality of electroless copper plating.

When the electroless copper plating work is finished, the pH value can be adjusted to below 10 with dilute sulfuric acid. After the reaction of the electroless copper plating solution is stopped, the particulate matter in the solution is removed in time. When it is to be re-used, the pH value can be adjusted to the process range slowly and slowly with dilute alkali.

In short, whether it is electroless copper plating or electroless copper plating, the electroless copper plating solution should be correctly prepared according to the process specifications; strictly control the process conditions; carefully and carefully maintain the electroless copper plating solution; and strengthen the Post-processing. These are the keys to the final quality assurance of the product.