What is the cause of cracks in PCBA solder pins

As the density of electronic product assembly is getting higher and higher, the process requirements for PCBA assembly have become higher and higher. During the PCBA soldering process, bad imaginations have also begun to increase. Among them, tin cracking is a common defect of PCBA.

The cracks in the PCBA soldering process are mainly caused by the following reasons.

1. The solder joint is cracked due to the impact of external force.

2. When performing PCBA post-welding processing, because the cutting pliers are not sharp, the pull phenomenon occurs when cutting the feet, which causes cracks in the component feet and tin points.

3. Due to less tin, the welding strength of the welding place is not enough, which leads to easy cracking.

The tin cracks generated during the PCBA welding process also have a great relationship with the quality of the welding material. Poor quality will also affect the firmness of the solder. Under the influence of external forces, cracks are likely to occur.