What testing steps are included in SMT?

SMT testing means surface mount technology testing, which is an important link in the production process of electronic products. It can detect and verify the correctness, quality and reliability of electronic components on PCB boards, ensuring that the electronic products produced meet quality standards and customer requirements. The following are the main steps of SMT testing:

1. Inspection before component pasting: Carefully check whether each solder joint and component installation position on the PCB board are correct, and check whether there are short circuits and open circuits.

2. Automated optical inspection (AOI): Use dedicated optical inspection equipment to automatically inspect components to verify whether they are correctly installed in the correct position. The equipment can also detect the polarity and direction of components, etc.

3. X-ray inspection of flip-chip package (TQFP): In this step, an X-ray inspection device is used to scan the solder joints under the TQFP package to detect whether there are any defects or problems. This ensures that the components will not be damaged during the production process.

4. Electrostatic sensitive component (ESD) test: Test whether components with high ESD levels are installed based on electrostatic sensitivity to prevent components from being damaged in situations related to static electricity.

5. Automated Assembly Test (ATE): This is a complete test of the test circuit board, including power supply, input and output, logic state of the circuit board, etc. Through this process, it can be determined whether the electronic product meets the standards.

SMT testing is a very strict process to ensure the quality and reliability of the electronic product installation and manufacturing process. When we use electronic products in various fields, we must thank the production process of SMT testing to ensure the quality and reliability of the electronic products we use.