Criteria For PCBA Solder Joint Failure

During the PCBA production process, affected by some unstable factors, PCBA solder joints may cause defects. For the soldering of PCBA solder joints, there is generally an acceptable range. Above a certain limit, it will affect the reliability of the product and will be judged as defective.

The evaluation criteria of PCBA solder joint defects are as follows:

1.The pad is not completely covered by solder

Exposed non-round pad corners and round pads should be judged as bad solder joints.

2.Corrosion

Parts feet or green paint are deteriorated, and discoloration is caused by poor solder joints.

3, tin tip

The solder point of the module protrudes more than 0.5mm.

4, tin crack

Cracked or cracked solder.

5, solder joint width

A solder joint width that is less than 75% of the component solder end width (W) or less than 50% of the pad width (P) is considered defective.