Detailed Explanation Of The Basic Structure Of The Horizontal Electroplating System
We have introduced a lot of relevant knowledge about the horizontal electroplating system, I believe everyone knows, in fact, the horizontal electroplating is based on the extension of the vertical electroplating technology, which can act on higher-precision circuit boards. Today, the editor brings you the basic structure of the horizontal electroplating system, let's take a look!
Basic structure of horizontal plating system
According to the characteristics of horizontal electroplating, it is an electroplating method in which the printed circuit board is placed vertically to parallel to the level of the plating solution. At this time, the printed circuit board is the cathode, and some horizontal plating systems use conductive clamps and conductive rollers. From the convenience of the operating system, the power supply mode with the scroll wheel turned on is more common. The conductive roller in the horizontal electroplating system not only functions as a cathode, but also has the function of transporting the printed circuit board. Each conductive roller is equipped with a spring device, which can meet the needs of electroplated printed circuit boards of different thicknesses (0.10-5.00mm). However, during the electroplating process, the parts in contact with the plating solution may be plated with a copper layer, and the system will not work for a long time. Therefore, most of the current horizontal electroplating systems are designed to switch the cathode to the anode, and then use a set of auxiliary cathodes to electrolyze the copper on the electroplating roller. For maintenance or replacement, the new electroplating design also considers parts that are easy to lose and easy to disassemble or replace. The anode adopts a set of adjustable size insoluble titanium baskets, which are respectively placed on the upper and lower positions of the printed circuit board 00. It is equipped with 25 mm spherical copper with a phosphorus content of 0.004-0.006%. The distance between the cathode and anode is 40 mm.
The manufacturing of the horizontal electroplating system should consider the convenience of operation and the automatic control of process parameters. Because in actual electroplating, with the size of the PCB, the size of the through hole and the thickness of the copper, the transmission speed, the distance between the printed circuit boards, the horsepower of the pump, the direction of the nozzle and the current density, all process parameters are required Test, adjust and control. To obtain the copper layer thickness that meets the technical requirements. Computer control is necessary. In order to improve the production efficiency and the consistency and reliability of the quality of high-quality products, the pre-processing and post-processing of the through-holes of the printed circuit board (including electroplating holes) form a complete horizontal electroplating system according to the process flow, which can meet the needs of new product development and marketing. .
Basic structure of horizontal plating system
The plating solution flow is a system composed of pumps and nozzles, which makes the plating solution flow alternately and rapidly in the closed plating tank to ensure the uniformity of the plating solution flow. The plating solution is sprayed vertically onto the printed circuit board, forming a wall spray vortex on the surface of the printed circuit board. The ultimate goal is to achieve rapid flow of plating solution on both sides of the printed circuit board and through holes to form eddy currents. In addition, there is a filtering system in the tank, and the mesh of the filter screen is 1.2 microns to filter and remove the particulate impurities generated during the electroplating process to ensure that the plating solution is clean and pollution-free.
The above is the basic structure of the horizontal electroplating system prepared by the editor for you! It's full of dry goods! Be sure to remember to collect them all!
