Detailed Explanation Of The Production Process Of Double-sided Multilayer Pcb Circuit Boards [tags]

Publish Time: January 05,2019

1. The production process of double-sided immersion gold board: cutting----drilling-----sinking copper----line---picture electricity----etching-----solder mask ---Character----Spray tin (or heavy gold)-Gong edge-V cut (some boards don’t need)-----Fly test----Vacuum packaging,

2. The production process of the double-sided gold-plated board: cutting-drilling--sinking copper-circuit-map electricity--gold plating-etching-- -Solder Mask----Character-----Gong Edge---V Cut---Fly Test---Vacuum Packaging

Double-sided multilayer circuit board production

3. The production process of multi-layer immersed gold board: cutting-inner layer--lamination-drilling--sinking copper-circuit--map electricity- ---Etching-----Solder Mask---Character----Spray Tin (or Immersion Gold)-Gong Edge—V Cut (Some Boards Not Needed)-----Fly Test---- Vacuum packaging 4. Multi-layer gold-plated board production process: cutting-inner layer-lamination-drilling-sinking copper-circuit-map electricity ----Gold-plated----etching----solder mask----character-----gong edge---v cut---flying test---vacuum packaging