What Is The Difference Between SMD And SMT?

With the application and development of electronic technology in modern society, SMT (Surface Mount Technology) is becoming increasingly popular because of its small assembly size and high efficiency. However, SMT and SMD are often easily confused and sometimes used interchangeably.

SMT (Surface Mount Technology) is essentially a technical method of arranging components onto a circuit board, whereas SMD (Surface Mount Devices) are actual assemblies that are mounted on a circuit board according to specific components. The following Tecoo Electronic specific take you to understand:

· SMT (Surface Mount Technology): a new method of arranging components on a printed circuit board. SMT assembly is a more efficient process where components are soldered directly to the board. By eliminating the need to pass leads through the PCB, the process becomes faster, more efficient and more cost-effective. At the same time, SMT assembly is more space efficient, allowing more components to be mounted on smaller boards, which is why many devices are now small in size but have many features.
SMT is a complex process in which the mounting position of each component is strictly set to ensure that the board achieves optimal functionality. During SMT, an appropriate amount of solder paste is applied evenly to the board before the machine mounts each component. However, mounting components directly to the surface is more efficient than routing them through the board, allowing the entire board to run faster and with less surface area.
In addition, surface mount technology offers the possibility of automation, whereby machines can be programmed to mount selected components directly onto the PCB in a short period of time. This means faster production processes, higher quality and lower risks.

· SMD (Surface Mounted Device): The actual component mounted on the printed circuit board. Today's newer SMDs use pins that can be soldered directly to the PCB instead of using leads to route through the board. The advantages of using pins versus leads are many, for example, smaller components can be used to fulfill the same function, which means that more components can be mounted on a smaller board with added functionality. At the same time, the mounting process is faster and more cost-effective as there is no need to drill holes in the board.
In contrast to the manual soldering of SMDs in the past, today it is possible to mount SMDs (such as resistors, ICs and other components) automatically on the surface of the PCB, and with the correct layout process, SMDs can be operated at a highly efficient level for a longer period of time.
In summary, the main difference between the two is that one refers to the mounting process (SMT) and the other to the actual component (SMD). However, in many cases, the two overlap: for example, the correct selection and placement of SMDs is the main SMT process, while SMT assembly is the workflow or strategy used to use SMDs more efficiently.

Finally, using the right technology can dramatically improve prototyping. For example, automated SMT machines are capable of mounting thousands of SMDs onto a board in a short period of time. In addition, the choice of SMDs will determine the effectiveness of the overall SMT; the SMDs determine the physical capacity of the electronic board (area) and the SMT is what mounts these components on the board in a timely manner.