Four Points To Be Noted In PCBA Patch Processing

Publish Time: January 05,2019

1. SMT patch assembly

The printing of solder paste in SMT placement and the systematic quality control details of reflow soldering temperature control are key nodes in the PCBA manufacturing process. At the same time, for the printing of high-precision circuit boards with special and complex processes, laser stencils need to be used according to specific circumstances to meet the requirements of higher quality and more demanding circuit boards. According to the PCB manufacturing requirements and customer product characteristics, some may need to increase the U-shaped hole or reduce the steel mesh hole. The steel mesh needs to be processed according to the requirements of PCBA processing technology.

Among them, the temperature control accuracy of the reflow soldering furnace is very important for the solder paste wetting and the stencil welding, and can be adjusted according to the normal SOP operation guidelines. In order to minimize the quality defects of PCBA patch processing in the SMT link. In addition, strict implementation of the AOI test can greatly reduce the defects caused by human factors.

2. DIP plug-in after welding

DIP plug-in post soldering is the most important process in the processing stage of the circuit board, and it is also the last process. In the post-welding process of the DIP plug-in, the consideration of the furnace fixture for wave soldering is very critical. How to use furnace fixtures to greatly improve the yield and reduce soldering defects such as connected tin, less tin and tin shortage, and according to the different requirements of customers' products, pcba processing plants must continuously sum up experience in practice and realize the upgrading of technology in the process of accumulation of experience.

3. Test and program burning

The manufacturability report should be an evaluation work before the entire production after receiving the customer's production contract.

In the previous DFM report, we can provide some suggestions to the customer before the PCB processing. For example, set some key test points on the PCB to carry out the PCB soldering test and the key test of the continuity and connectivity of the circuit after PCBA processing. When conditions permit, you can communicate with the customer to provide the back-end program, and then burn the PCBA program into the core master IC through the burner. In this way, the circuit board can be tested in a simple manner through touch action, so as to test and verify the integrity of the entire PCBA, and find defective products in time.

4. PCBA manufacturing test

In addition, many customers looking for PCBA processing through-train service also have requirements for PCBA back-end testing. The contents of this test generally include ICT (circuit test), FCT (functional test), burn test (aging test), temperature and humidity test, drop test, etc.