Highly Complex PCBA Assembly Engineering Capabilities Of Electronic Manufacturing Services Manufacturers!
For electronic manufacturing services manufacturers, the biggest problem we encountered is that electronic manufacturing services factories are not graded, and there is no clear positioning for whether they are suitable for high-complexity boards in terms of personnel quality, equipment capabilities, and on-site process control capabilities. We have also considered adopting different methods for different suppliers, for example, using routing methods to solve the problem. However, can there be a clear requirement for the improvement of the capacity of the entire electronic manufacturing services factory and the improvement of personnel capacity? Moreover, there are also problem electronic manufacturing services with the line you set, whether the ability can be quantified. For example, for a board with a complexity of more than 200, it is not clear what kind of corresponding relationship the technical capabilities and equipment capabilities of the corresponding personnel have.
Highly complex PCBA assembly requirements
Whether it is an electronic manufacturing services manufacturer that provides assembly services or we do the processing ourselves, for the control of high-complexity PCBA, it can be quantified into five aspects-personnel, mechanical equipment, materials, process, and environment.
Personnel: Designate a special production line to process high-complexity boards, and formulate strict regulations and requirements for its equipment maintenance and operating personnel, including training, examinations, employment standards, etc.
Mechanical equipment: There are strict control requirements for each piece of equipment in each high-complexity product production line, including strict operating guidelines and inspection requirements.
Materials: Control and reduce tube materials; dimensional stability and solder end consistency of 0402 and 0201 micro devices should be better; pay attention to check whether the PCB is obviously deformed; the requirements for soldering temperature of various types of device coatings and solder ends should be basically the same ; The dimensions of large-size connectors and module package reflow soldering deformation should be within the allowable range and so on.
Process: For the control of process regulations, we now have a more than 30-page control procedure for the assembly of highly complex PCBA, each step, including before boarding, to the replacement and addition of tin printing and solder paste, to the stencil There are strict control requirements for the inspection before going on the machine, as well as net wipes, board washing water, etc.
Environment: Environmental conditions for material storage, anti-static management, management of moisture-sensitive devices, storage and turnover distribution of IC devices must be strictly controlled.
For PCBAs of different complexity, electronic manufacturing services manufacturers adopt different strategies in terms of personnel composition, equipment configuration, and process control to form hierarchical processing capabilities to meet different customer needs; different processing costs can be required according to different PCBA complexities.
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