How To Design The Heat Dissipation Of PCB
PCB circuit board heat dissipation design skill one: the importance of thermal design
The electrical energy consumed by electronic equipment during work, such as RF power amplifier, FPGA chip and power supply products, is mostly converted into heat emission except for the useful work.The heat generated by the electronic equipment makes the internal temperature rise rapidly. If the heat is not released in time, the equipment will continue to heat up, and the device will fail due to overheating, and the reliability of the electronic equipment will decrease.SMT increases the installation density of electronic equipment, reduces the effective heat dissipation area, and seriously affects the reliability of equipment temperature rise. Therefore, it is very important to study the thermal design.
Radio-frequency brothers have wood, so you can cool it?
For the heat dissipation of PCB board is a very important link, so what is the heat dissipation skill of PCB board, let's discuss it together.
For electronic equipment, a certain amount of heat will be generated during operation, thus rapidly increasing the internal temperature of the equipment. If the heat is not released in a timely manner, the equipment will continue to heat up, the device will fail due to overheating, and the reliable performance of the electronic equipment will decline.Therefore, it is very important to have a good heat dissipation treatment on the circuit board.
PCB cooling design technique 2: PCB temperature rise factor analysis
The direct cause of PCB temperature rise is the existence of circuit power dissipation devices, and the power dissipation of electronic devices varies, and the heat intensity varies with the power dissipation.
Two phenomena of temperature rise in printed board:
(1) Local temperature rise or large area temperature rise;
(2) Short-term temperature rise or long-term temperature rise.The thermal power consumption of PCB is generally analyzed from the following aspects.
2.1 Electrical power consumption
(1) Analyze the power consumption per unit area;
(2) Analyze power consumption distribution on PCB board.
2.2 Structure of printed board
(1) The size of the printed board;
(2) Printed board materials.
2.3 Installation method of printed board
(1) Installation mode (such as vertical installation, horizontal installation);
(2) Sealing condition and distance from the casing.
2.4 thermal radiation
(1) Radiation coefficient on the surface of the printed board;
(2) The temperature difference between the printed board and the adjacent surface and their absolute temperature
2.5 heat conduction
(1) Install the radiator;
(2) Conduction of other installation structures.
2.6 heat convection
(1) Natural convection;
(2) Forced cooling convection.
The analysis of the above factors is an effective way to solve the temperature rise of printed board. These factors are often interrelated and dependent in a product and system. Most of the factors should be analyzed according to the actual situation.
