How To Solve FPC Flexible Circuit Board Overflow Glue

Publish Time: January 05,2019

Spilled glue is a common phenomenon of abnormal quality in the FPC flexible circuit board lamination process. Glue overflow refers to the temperature increase in the lamination process, which causes the glue system in the COVERLAY to flow, which leads to the problem of glue stains similar to the EXPORY series on the PAD position of the FPC flexible circuit board. There are many reasons for FPC flexible circuit board overflow glue, so we should propose different solutions according to the specific situation.

1. Spilled glue is caused by COVERLAY manufacturing process

Then, FPC flexible circuit board manufacturers should strictly inspect incoming materials. If the spilled glue exceeds the standard during the incoming sample inspection, contact the supplier for return or exchange, otherwise it is difficult to control the spilled glue during the production process.

2. Spilled glue is caused by the storage environment

FPC flexible circuit board manufacturers are better to establish a special freezer to save the protective film. If the CL glue system is damp due to the lack of storage conditions, the CL can be pre-baked at a low temperature, which can greatly reduce the amount of CL glue overflow. In addition, CLs that have not been used up on the day need to be put back in the freezer in time for storage.

3. Local glue overflow caused by independent small PAD bits

This phenomenon is one of the most common quality anomalies encountered by most FPC flexible circuit board manufacturers. If the process parameters are changed simply to solve the glue overflow, it will bring new problems such as bubbles or insufficient peel strength, we need to reasonably adjust the process parameters.

4. Spilled glue brought by the operation method

When the FPC flexible circuit board is falsely connected, employees are required to accurately align and correct the alignment fixture, and at the same time increase the inspection strength of the alignment to avoid overflow of glue due to inaccurate alignment. At the same time, do the "5S" work when pressing the false joint. Before the alignment, check whether the protective film CL is contaminated and has burrs.

5. Spilled glue caused by FPC flexible circuit board factory process

If a fast press is used for pressing, properly extending the pre-pressing time, reducing the pressure, lowering the temperature, and reducing the pressing time will help to reduce the amount of glue overflow. If the pressure of the press is not uniform, you can use induction paper to test whether the pressure of the press is uniform. You can contact the supplier of the fast press to debug the machine equipment.