Methods To Prevent Pores in PCBA Processing And Welding

Publish Time: January 05,2019

The PCBA board will produce pores that affect the quality of the board during the welding process, which is also commonly known as air bubbles. Today we have invited professional technicians from Taike to tell you how to prevent pores in PCBA processing and welding!

1. Bake, bake PCBs and components that have been exposed to the air for a long time to prevent moisture.

2. The control of solder paste, the solder paste contains moisture and is prone to pores and tin beads. First select a good quality solder paste. The temperature recovery and stirring of the solder paste are strictly performed according to the operation. The time for the solder paste to be exposed to the air is as short as possible. After the solder paste is printed, reflow soldering needs to be carried out in time.

3. Workshop humidity control. The humidity of the workshop is monitored in a planned way, and it is controlled between 40-60%.

4. Set a reasonable furnace temperature curve, test the furnace temperature twice a day, optimize the furnace temperature curve, and the heating rate cannot be too fast.

5. Flux spraying. During wave soldering, the spraying amount of flux should not be too much, and the spraying should be reasonable.

6. Optimize the furnace temperature curve. The temperature of the preheating zone must meet the requirements, not too low, so that the flux can be fully volatilized, and the speed of passing the furnace cannot be too fast.

There are many factors that may affect PCBA soldering bubbles. It can be analyzed from the aspects of PCB design, PCB humidity, furnace temperature, flux (spray size), chain speed, tin wave height, solder composition, etc. After many tests, it is possible to get a better process.

These are all methods that can avoid pores during PCBA processing and soldering. I hope it can help you!