The Following Points Can Prevent Component Deviation in Chip Processing!

In SMT factories, the correct welding of components directly affects the welding quality, and the offset of the components is a particularly important part of the welding quality. How does SMT electronics factory prevent component shift in chip processing? Today, the editor will explain to everyone!

1. Strictly calibrate the positioning coordinates to ensure the accuracy of component placement.

2. Use solder paste with good quality and high adhesion to increase the SMT mounting pressure of the components and increase the bonding force.

3. Choose the appropriate solder paste to prevent the solder paste from collapsing, and the solder paste has a suitable flux content.

4. Adjust the fan motor speed.

In fact, in the reflow soldering process of SMT chips, in addition to component displacement, there are many other possible defects, such as vertical flipping of the side. However, these shortcomings can be resolved. From circuit board design to excellent PCB board production, to responsible SMT chip processing, we can fundamentally improve the quality of reflow soldering and prevent the displacement of components from components to solder paste and components.