What Are The Pcba Aging Test Standards?

The aging test of PCBA is carried out through the comprehensive effect of high temperature, low temperature, high and low temperature changes and electric power. The purpose is to simulate the daily use environment of the product, thereby exposing PCBA defects, such as poor soldering, component parameter mismatch, and debugging. Faults, etc., thereby eliminating and improving the defect-free PCBA board, which plays a role in stabilizing parameters. Today we will take a look at the aging test standards.

1. Low temperature work

       After placing the PCBA board at a temperature of -10±3°C for 1h, under this condition, the rated load should be carried. Under the conditions of 187V and 253V, all procedures should be powered on and the procedures should be correct.

2. High temperature work

       After the PCBA board is placed at 80±3℃/h, under this condition, with load, under the conditions of 187V and 253V, power on and run all the programs. The program should be correct.

3. High temperature and humidity work

       Put the PCBA board at a temperature of 65±3°C and a humidity of 90-95% for 48 hours, and run the programs with the rated load. Each program should be correct.