What Are The Quality Problems That Are Easily Caused By Urgent PCB Proofing Of Circuit Boards?

1: The thickness of the pad coating is not enough, resulting in poor soldering, and the pad surface coating thickness of the component to be mounted is not enough. If the tin thickness is not enough, it will cause insufficient tin when melting at high temperature, and the component and the pad cannot be soldered well. Our experience is that the thickness of the solder on the surface of the pad should be "100μ'". 2: The surface of the pad is dirty, causing the tin layer to not infiltrate and the board surface is not cleaned. If the gold board has not passed the cleaning line, it will cause impurities on the surface of the pad. Poor welding. 3: The pad on the wet film is offset, causing poor soldering, and the pad on the wet film that needs to be mounted on the component will also cause poor soldering. 4: The pad is defective, causing the component to fail to be soldered or not to be soldered firmly.

Circuit board pcb proofing urgent

5: BGA pads are not developed cleanly, there are wet films or impurity residues, which cause false soldering when soldering is not applied. The plug hole at the BGA is protruding, causing insufficient contact between the BGA component and the pad, and it is easy to open. The solder mask at the BGA is too large, which leads to exposure of copper in the circuit connected to the pad and short circuit of the BGA patch. 6: The distance between the positioning hole and the pattern does not meet the requirements, causing the printed solder paste to deviate and short-circuit. 7: The green oil bridge between IC pads with dense IC pins is broken, resulting in poor printed solder paste and short circuit. The via plugs next to the IC are protruding, causing the IC to fail to mount. 8: The stamp hole between the units is broken and solder paste cannot be printed. Drilling the identification light spot corresponding to the wrong fork plate, and automatically attaching the parts incorrectly, resulting in waste. The second drilling of the NPTH hole causes a large deviation in the positioning hole and leads to a deviation of the printed solder paste. 9: Light spot (next to IC or BGA), which needs to be flat, matte, and not chipped. Otherwise, the machine will not be able to identify it smoothly, and it will not be able to automatically attach parts. The mobile phone board is not allowed to re-sink the nickel, otherwise the nickel thickness will be severely uneven. Affect the signal.