What Factors Should Be Paid Attention To When Designing Circuit Boards?

Excellent circuit boards are often inseparable from the reasonable settings of the circuit board factory, so what factors should be paid attention to in the process of designing the circuit board?

First. Plate thickness

The thickness of the multi-circuit board substrate is determined by a variety of factors, such as the number of signal layers, the number and thickness of power boards, the aspect ratio of the aperture and thickness required for high-quality punching and plating, and automatic insertion of component pins Length and type of connection used. The thickness of the entire circuit board is composed of a conductive layer, a copper layer, a circuit board substrate thickness, and a prepreg material thickness on both sides of the circuit board board. Obtaining tight tolerances on a synthetic multi-PCB substrate is difficult, and a tolerance standard of about 10% is considered reasonable.

Second. Hole

Depending on the component pin diameter or the size of the diagonal line, the diameter of the plated through hole is usually maintained between 0.02 and 0.010 in. This can ensure sufficient volume for better soldering.

Third, mechanical design factors

The mechanical design includes selecting the appropriate board size, board thickness, board stacking, inner copper cylinder, aspect ratio, etc.

Fourth. Board size

Board size should be optimized based on application requirements, system box size, board manufacturer limitations and manufacturing capabilities.