Why Do Solder Joints Fail in PCBA Processing

With the development of miniaturization and precision of electronic products, the PCBA processing and assembly density adopted by the chip processing plant is getting higher and higher, the solder joints in the circuit board are getting smaller and smaller, and the mechanical, electrical and thermal loads they carry It is getting heavier and heavier, and the requirements for stability are also increasing. However, the problem of PCBA solder joint failure will also be encountered in the actual processing process. It is necessary to analyze and find out the reason to avoid recurrence of solder joint failure. Let's take a look with the editor today!

The main reasons for the failure of PCBA processing solder joints:

1. Bad component leads: plating, pollution, oxidation, coplanarity.

2. Bad PCB pads: plating, pollution, oxidation, warpage.

3. Solder quality defects: composition, impurity, and oxidation are not up to standard.

4. Flux quality defects: low solderability, high corrosion, low SIR.

5. Defects in process parameter control: design, control, and equipment.

6. Defects of other auxiliary materials: adhesives, cleaning agents.

How to increase the stability of PCBA solder joints:

For the stability experiment of PCBA solder joints, including stability experiment and analysis, its purpose is to evaluate and appraise the stability level of PCBA integrated circuit devices on the one hand, and to provide parameters for the stability design of the whole machine.

On the other hand, during PCBA processing, it is necessary to improve the stability of solder joints. This requires the analysis of failed products, find out the failure mode, and analyze the cause of the failure. The purpose is to modify and improve the design process, structural parameters, welding process, and improve the yield of PCBA processing. The failure mode of PCBA solder joints is the basis for predicting its cycle life and establishing its mathematical model.